How AI Improves Data Center Efficiency

Data centers are evolving rapidly to meet the demands of advanced computing. Key aspects for modern data centers include: • Custom chip design for specialized workloads • Advanced packaging and High Bandwidth Memory (HBM) • High-speed interconnects for massive data flow • Focus on performance per watt and tokens per watt Traditional data center infrastructure struggles with the scaling requirements of contemporary models. This necessitates a move towards purpose-built hardware, where every component, from the compute die to memory and interconnects, is optimized for specific computational tasks. Custom chip design, particularly Application-Specific Integrated Circuits (ASICs), allows for tailoring hardware to exact company needs, achieving superior performance within given power and cost constraints. MediaTek leverages decades of expertise in power-efficient silicon to enhance data center performance. By integrating custom ASIC design with cutting-edge packaging and memory technologies like HBM, and utilizing high-speed interconnects such as NVLink Fusion and co-packaged optics, they optimize the entire compute system. This approach aims to maximize 'tokens per watt,' ensuring efficient processing for gigawatt-scale infrastructure. This technology is ideal for organizations building next-generation data centers, hyperscalers, and enterprises with demanding computational workloads. It supports the efficient training and serving of large models, enabling continued scaling while effectively managing power consumption and operational costs.